Basic description:
UV type is used while dicing a wide range of work-pieces, including various types of wafers, package substrates, ceramics, glass, and crystal. For easy peeling, UV dicing tape is exposed to UV light, to weaken its adhesive strength.
【product features】
● Wide range of items available with different adhesive thicknesses (5μm-)
● Prevents die-fly off and chipping (cracking) on the backside surface
● Easy pickup (easy to peel)
● Exhibits superior adhesive qualities for workpieces that are incredibly anti-adhesive, such as EMC (epoxy molding compounds)
* Anti-static types are available (optional)
【Range of Application】
● Wafer grinding protection applications
【Physical data】
※ If there are models not included, please consult.
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