• H300-HR
Dicing Tape (pressure-sensitive adhesive type)

Basic description:
Pressure-sensitive adhesive tape is used while dicingvarious types of wafers. We provide the best possible tapes to meet various range of needs.

【product features】

   ● Superior storage time stability
   ● Two available colors: milky white and light blue
   ● Anti-static types are also available (optional)

【Range of Application】
   ● Wafer cutting applications

【Physical data】
   

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If there are models not included, please consult