Basic description:
Back grinding tapes protect the surface of wafer circuits and prevent them from being damaged during back grinding.Featuring an adhesive agent that eliminates the need for cleaning, ELEGRIP® tapes ensure low particle count and stable grinding performance.
【product features】
●Exhibits superior adhesive quality on roughness of patterned surfaces
● Ensures stable grinding performance during back grinding (Low TTV*1)
● Delivers stable low particle count performance, eliminating the need for cleaning
● Exhibits stable adhesive strength, unaffected by storage time
* 1TV=Total Thickness Variation
【Range of Application】
● Wafer grinding protection applications
【Physical data】
※ If there are models not included, please consult
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