Basic description:
The material is filmed with low dielectric resin, which has excellent dielectric constant performance and low tangent loss even in high frequency band. It is an excellent film material in the field of 5G high-frequency communication and other data transmission.
【product features】
● Compared with polyimide film, the material has lower tangent loss
● The temperature resistance is about 200 ℃, and the dielectric constant is low (10GHz: dielectric constant ≈ 2.34, tangent loss ≈ 0.0005)
● Compared with PET film, the modified product has water decomposition resistance
● Corresponding range of thickness: 25μ~50μ~75μ
【Range of Application】
● As thin film material of antenna substrate
● Other substrate film materials for signal transmission and transmission devices
【Physical Property Data】
※ Please consult the sales staff for specific product performance and other technical indicators.
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